Dowsil™ / Dow Corning one-part moisture cure adhesives are generally cured at room temperature and in an environment of 30 to 80 percent relative humidity eliminating the need for curing ovens and the associated costs of energy and capital. Greater than 90 percent of full physical properties should be attained within 24 to 72 hours and varies according to product.
Bonding large components such as batteries or capacitors to circuit boards
- Room temp cure
- High elongation for added stress relief
- No mixing required
- RT cure, no ovens required
- Faster in-line processing with optional heat acceleration
- Added reliability can result from lower cured stress